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Almost Brand New SET ACCuRA100 Flip Chip Bonder
Almost Brand New SET ACCuRA100 Flip Chip Bonder
Almost Brand New SET ACCuRA100 Flip Chip Bonder
Almost Brand New SET ACCuRA100 Flip Chip Bonder
Almost Brand New SET ACCuRA100 Flip Chip Bonder
Almost Brand New SET ACCuRA100 Flip Chip Bonder
Almost Brand New SET ACCuRA100 Flip Chip Bonder
Almost Brand New SET ACCuRA100 Flip Chip Bonder

Almost Brand New SET ACCuRA100 Flip Chip Bonder

$ 104544

Availability: 34 in stock
  • MPN: Does Not Apply
  • All returns accepted: Returns Accepted
  • Restocking Fee: No
  • Operation: Automatic
  • Brand: SET
  • Equipment Type: Flip Chip Bonder
  • Condition: Almost Brand New
  • Refund will be given as: Money Back
  • Country/Region of Manufacture: France
  • Return shipping will be paid by: Buyer
  • Custom Bundle: No
  • Item must be returned within: 14 Days

    Description

    Almost Brand New SET ACCuRA 100 Flip Chip Bonder
    You are biting  one set almost brand new
    SET ACCuRA 100 Flip Chip
    Bonder
    . This machine was manufactured in 2018 and was installed in one of our partner
    ’
    s R&D lab.  Since last 2 years pandemic, the lab was closed and these brand new equipment need to be relocation.  This set   SET ACCuRA 100 Flip Chip
    Bonder
    original buy in price is US2,500.00.  and we are looking for sell at only US8,000.00.
    Description
    The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.
    Applications
    ·
    Micro assembly
    ·
    Laser diode, laser bar
    ·
    VCSEL, photo diode
    ·
    LED
    ·
    Flip-chip bonding, die bonding
    ·
    Chip-to-chip, chip-to-substrate bonding
    ·
    MOEMS, MEMS, MCM packaging…
    ·
    3D packaging
    ·
    Nanoimprinting (UV NIL and Hot Embossing)
    Industries
    ·
    Semiconductors
    ·
    Memory
    ·
    Optoelectronics and Silicon Photonics
    ·
    Micro LEDs Displays
    ·
    Quantum Computing
    Key features
    ACCµRA100
    ·
    Accuracy ± 0.5 µm
    ·
    Easy to use and very flexible
    ·
    Quick set-up for new applications
    ·
    Cost-effective
    ·
    Small footprint and compact design
    ·
    High bonding force
    Technical specifications
    Contact us for more information